Vapor Chamber
Vapor ChamberHigh-performance heat spreading for advanced electronics.
A vapor chamber is a flat heat spreading device that utilizes phase change to rapidly transfer heat from a localized source to a wider area. Compared to traditional heat sinks, it offers superior thermal performance, lower thermal resistance, and more uniform temperature distribution.
KEY FEATURES
- Ultra-thin design : Thickness down to 0.3mm, ideal for compact devices
- Excellent heat spreading : Rapid heat distribution across the entire surface
- Low thermal resistance : Improved thermal performance compared to traditional solutions
- Passive & highly reliable : No moving parts, ensuring long-term stability
HOW IT WORKS
- Heat from the source causes the internal liquid to evaporate
- Vapor spreads rapidly across the chamber
- Vapor condenses into liquid at cooler areas
- Liquid returns via capillary structure
This continuous cycle enables highly efficient heat transfer.
ADVANCED TECHNOLOGY
- Directional Vapor Flow Design : Enhanced vapor movement for improved thermal performance
- Composite Wick Structure : Combination of mesh and fiber for optimized liquid return
- Ultra-Thin VC Technology : Optimized internal structure for ultra-thin applications
- High-Strength Copper Materials : Improved mechanical strength and durability
APPLICATIONS
- Servers & Data Centers : High-performance computing and AI systems
- Electric Vehicles : Power modules, IGBT cooling systems
- Mobile Devices : Smartphones, tablets, compact electronics
- Telecom & Networking : 5G infrastructure and communication equipment
CUSTOMIZATION
JARO provides flexible customization to meet diverse thermal requirements :
- Custom size and thickness
- Thermal simulation support
- Integration with heatsinks and fans
- Design optimization based on application
Looking for a reliable thermal solution?
Contact us for customization and sample requests.
