Thermal Potting Compound
Thermal Interface Material Thermal Potting CompoundThermal Interface Material
Thermal Potting Compounds deliver reliable thermal performance for advanced electronics. With high thermal conductivity (2.0–10.0 W/m·K), soft and stress-free protection for sensitive components, UL94 V-0 flame resistance, and excellent electrical insulation, they ensure long-term stability and safety. Available as silicone gels and putties, they are ideal for automated dispensing and meet RoHS and Halogen-Free requirements.
Features :
- Powerful Heat Transfer – Thermal conductivity up to 8.0 W/m·K for efficient cooling.
- Gentle on Components – Soft and compressible to protect sensitive electronics.
- Built-In Electrical Safety – Excellent insulation to prevent short circuits.
- Proven Reliability – Stable performance without cracking or dripping, even under extreme temperatures.
- Production-Ready – Optimized for precise automated dispensing.
- Eco-Friendly & Compliant – Meets RoHS, Halogen-Free, and REACH standards.
Applications :
- Telecom
- Automotive
- Medical Devices
- Computing (CPUs, GPUs, SSDs)
- Industrial & Military Electronics
| Model | Thermal Conductivity W/m·K | Viscosity after Mixed, cPs | Hardness After Curing, Shore A | DielectricStrength, kV/mm,AC |
|---|---|---|---|---|
| JSUS-5201-00 | 0.8 | 2000~3000 | 45±10 | ＞2.0 |
| JSUS-5201-10 | 1.0 | 2500~3000 | 20±5 | ＞2.0 |
| JSUS-5201-15 | 1.5 | 4000~4500 | 45±5 | ＞2.5 |
| JSUS-5201-20 | 2.0 | 6000~6500 | 20±5 | ＞2.5 |
| JSUS-5201-25 | 2.5 | 8000~8500 | 20±5 | ＞4.0 |
| JSUS-5201-30 | 3.0 | 22000~23000 | 60±5 | ＞4.5 |
| JSUS-5201-35 | 3.5 | 24000~25000 | 60±5 | ＞5.0 |
