Thermal Grease
Thermal Grease Thermal Interface MaterialThermal Interface Material
Thermal grease offers very low thermal impedance and excellent wet-out, effectively filling microscopic gaps between chips and heat sinks. With interface thicknesses as thin as 0.05 mm, it provides highly efficient heat transfer and remains stable up to 150°C. It can be applied manually or via screen printing.
Features :
- Thermal conductivity 1.0–5.0 W/m·K with low thermal impedance (0.015 ℃·in²/W @ 30 psi).
- Interface thickness as low as 0.05 mm.
- Stable up to 150°C with excellent dry-out resistance and no overflow.
- Ready to use—no preheating required.
- Compliant with RoHS, Halogen-Free, and REACH standards.
Applications :
- CPUs and GPUs
- Power Supply Units (PSUs)
- LED Modules
- Engine Control Units (ECUs)
- Gaming Consoles and Laptops
| Model | Thermal Impedance, ℃*in²/W at 30psi | Thermal Conductivity W/m·K | Minimal Interfacial Thickness, mm | Viscosity, Pa·s, at 25℃ | Density, g/cm³ | Operating Temp., ℃ |
|---|---|---|---|---|---|---|
| JSSG-0560-10 | 0.04 | 1.0 | 0.05 | 150 | 2.0 | -50~150 |
| JSSG-0560-20 | 0.035 | 2.0 | 0.05 | 200 | 2.2 | -50~150 |
| JSSG-0560-30 | 0.02 | 3.0 | 0.05 | 240 | 2.5 | -50~150 |
| JSSG-0560-40 | 0.017 | 4.0 | 0.05 | 350 | 2.6 | -50~150 |
| JSSG-0560-50 | 0.015 | 5.0 | 0.05 | 400 | 2.8 | -50~150 |
