JBHAE3001
Board-Level Heatsinks Heatsinks & Coolers PGA/BGADimensions: L30.7 x W30.7 x H14 mm
Features
- Efficient Heat Dissipation: BGA heatsinks quickly move heat away from components using materials like aluminum or copper.
- Compact Design: BGA heatsinks match the size of ICs or components, making them efficient in limited space.
- Secure Attachment: BGA heatsinks are often glued onto ICs or components using special adhesive for efficient heat transfer.
- Versatile Use: BGA heatsinks are used in various devices such as computers, servers, gaming consoles, and industrial systems.
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JBHAE3001 Products List
Product No. |
Material |
Dimensions |
Finish |
---|---|---|---|
JBHAE3001 | AL6063-T5 | L31 x W31 x H14 mm | Black Anodized |