JBHAE0801
Board-Level Heatsinks Heatsinks & Coolers PGA/BGADimensions: L8 x W8 x H8 mm
Features
- Efficient Heat Dissipation: BGA heatsinks quickly move heat away from components using materials like aluminum or copper.
- Compact Design: BGA heatsinks match the size of ICs or components, making them efficient in limited space.
- Secure Attachment: BGA heatsinks are often glued onto ICs or components using special adhesive for efficient heat transfer.
- Versatile Use: BGA heatsinks are used in various devices such as computers, servers, gaming consoles, and industrial systems.
JBHAE0801 Products List
Product No. |
Material |
Dimensions |
Finish |
|---|---|---|---|
| JBHAE0801 | AL6063-T5 | L8 x W8 x H8 mm | Black Anodized |