Thermal Conductive Adhesive
Thermal Conductive Adhesive Thermal Interface MaterialThermal Interface Material
The Thermal Conductive Adhesive is a single-component, silicone-based adhesive that combines excellent thermal conductivity, electrical insulation, and strong bonding performance. It is specifically designed for reliable attachment between heat sinks and heat-generating components.
Features :
- Thermal conductivity options of 1.0–2.0 W/m·K.
- Provides strong and reliable bonding strength.
- Offers excellent stability with long-term high-temperature resistance and no swelling.
- Compatible with automated dispensing systems.
- Fully compliant with RoHS, Halogen-Free, and REACH standards.
Applications :
- Communication Devices
- Power Supply Units (PSUs)
- LED Modules
- Engine Control Units (ECUs)
| Model | Thermal Conductivity W/m·K | Tack-Free Time, at 25℃, min | Full Cure Time, at 25℃, hrs | Bonding Strength, Mpa | Hardness, Shore A | Operating Temp., ℃ |
|---|---|---|---|---|---|---|
| JSTIV-800-10 | 1.0 | 5~10 | 24 | ≥ 1.5 | 40~60 | -50~200 |
| JSTIV-800-12 | 2.0 | 5~10 | 24 | ≥ 1.5 | 40~60 | -50~200 |
| JJSTIV-800-15 | 3.0 | 5~10 | 24 | ≥ 1.5 | 40~60 | -50~200 |
| JSTIV-800-20 | 4.0 | 5~10 | 24 | ≥ 1.5 | 40~60 | -50~200 |
