Thermal Gel
Thermal Gel Thermal Interface MaterialThermal Interface Material
Thermal Gel is a silicone-based, flexible gap filler with low thermal impedance, low oil bleed, and excellent extrusion properties. Its soft, highly compressible nature enables low-stress assembly and effective wet-out for complex gap variations. It is ideal for filling gaps between heat-generating components and heat sinks, and can be precisely dispensed with automated equipment.
Features :
- Thermal conductivity 2.0–10.0 W/m·K.
- Soft and highly compressible, applying low stress—ideal for delicate components.
- UL94 V-0 flame resistance and excellent electrical insulation (8 kV/mm).
- Stable with no cracking or dripping across wide temperatures.
- Compatible with automated dispensing for precise thickness and shape.
- Compliant with RoHS, Halogen-Free, and REACH standards.
Applications :
- CPUs and GPUs
- Power Supply Units (PSUs)
- LED Modules
- Engine Control Units (ECUs)
- Gaming Consoles and Laptops
| Model | Color | Thermal Conductivity W/m·K | Extrusion Rate, g/min, at 30cc, 90psi | Density, g/cc | Operating Temp., ℃ |
|---|---|---|---|---|---|
| JSSE-20 | Pink | 2.0 | 80±15 | 2.5 | -40~150 |
| JSSE-30 | Pink | 3.0 | 25±15 | 3.0 | -40~150 |
| JSSE-40 | Pink | 4.0 | 40±5 | 3.1 | -50~150 |
| JSSE-50 | Pink | 5.0 | 40±5 | 3.1 | -50~150 |
| JSSE-60 | Gray | 6.0 | 20±5 | 3.3 | -50~150 |
| JSSE-80 | Gray | 8.0 | 30±5 | 3.4 | -50~150 |
| JSSE-100 | Gray | 10.0 | 10±5 | 3.4 | -50~150 |
| Model | Color | Thermal Conductivity W/m·K | Extrusion Rate, g/min, at 50cc, 90psi | Density, g/cc | Hardness After Curing, Shore 00 |
|---|---|---|---|---|---|
| JSSE-200AB | White + Pink | 2.0 | 50±5 | 2.1 | 55±10 |
| JSSE-300AB | White + Pink | 3.0 | 20±5 | 3.0 | 55±10 |
| JSSE-400AB | White + Pink | 3.5 | 30±5 | 3.1 | 55±10 |
| JSSE-500AB | White + Pink | 5.0 | 15±5 | 3.1 | 55±10 |
| JSSE-600AB | White + Pink | 6.0 | 10±5 | 3.2 | 55±10 |
| JSSE-800AB | White + Pink | 8.0 | 10±5 | 3.2 | 55±10 |
