Phase Change Thermal Pad
Phase Change Thermal Pad Thermal Interface MaterialThermal Interface Material
Phase Change Thermal Pads are solid at room temperature with self-adhesive properties for easy handling. At 45–55°C, they soften and flow to provide paste-like wet-out, effectively filling gaps between heat sinks and electronic components. They support custom die-cutting, offer high reliability and easy operation, and provide thermal conductivity up to 6.0 W/m·K.
Features :
- Thermal conductivity 1.8–6.0 W/m·K with low thermal impedance (down to 0.015 ℃·in²/W @ 50 psi).
- Excellent wet-out with no spill risk after thermal cycling—an effective alternative to thermal grease.
- Self-adhesive for easy application and rework.
- Compliant with RoHS, Halogen-Free, and REACH standards.
Applications :
- CPU/GPU Chips
- Capacitors
- Memory/VRAM particles
- Control boards
- Splitters
- Relays
| Model | Color | Thermal Conductivity W/m·K | Thermal Impedance, ℃*in²/W at 20psi, 1mm | Custom Thickness, mm | Phase Change Temp., ℃ | Operating Temp., ℃ |
|---|---|---|---|---|---|---|
| JSSP-205A-30 | Gray | 3.0 | 0.05 | 01.3~0.5 | 45~55 | -40~125 |
| JSSP-205A-35 | Gray | 3.5 | 0.04 | 0.13~0.5 | 45~55 | -40~125 |
| JSSP-205A-40 | Gray | 4.0 | 0.03 | 0.2~0.5 | 45~55 | -40~125 |
| JSSP-205A-50 | Gray | 5.0 | 0.02 | 0.2~0.5 | 45~55 | -40~125 |
| JSSP-205A-60 | Gray | 6.0 | 0.015 | 0.2~0.5 | 45~55 | -40~125 |
| JSSP-205A-L80 | Gray | 8.0 | 0.007 | 0.2~0.5 | 45~55 | -20~100 |
| JSSP-350P | Green | 1.8 | 0.4 | 0.2~0.5 | 45~55 | -20~120 |
