Carbon Fiber Thermal Pad
Carbon Fiber Thermal Pad Thermal Interface MaterialThermal Interface Material
The Carbon Fiber Thermal Pad is extremely soft and compressible, effectively filling gaps to eliminate air and enhance heat transfer. It offers thermal conductivity up to 45.0 W/m·K.
Features :
- Thermal conductivity 15–45 W/m·K; thickness options 0.3–12.0 mm.
- Naturally tacky for easy installation and rework.
- Soft, elastic, and highly compressible—ideal for low-pressure applications.
- Low silicone oil bleed; customizable shapes available.
- Excellent flexibility, resilience, and thermal stability.
- Meets RoHS, Halogen-Free, and REACH standards.
Applications :
- 5G Base Station RRU
- Chips
- Capacitors
- Memory/Graphics Memory Particles
- Hard Drives
- Control Boards
- Shunts
- Relays
| Model | Thermal Conductivity W/m·K | Thermal Impedance, ℃*in²/W at 20psi, 1mm | Thickness, mm | Standard Hardness, Shore 00 | Custom Hardness, Shore 00 | Dielectric Strength, kV/mm | Operating Temp., ℃ |
|---|---|---|---|---|---|---|---|
| JSCSF-0015 | 15.0 | 0.28 | 0.3~12.0 | 40/60 | 40~90 | 0.1 | -50~160 |
| JSCSF-0020 | 20.0 | 0.18 | 0.3~12.0 | 40/60 | 40~90 | 0.1 | -50~160 |
| JSCSF-0025 | 25.0 | 0.12 | 0.3~12.0 | 40/60 | 40~90 | 0.1 | -50~160 |
| JSCSF-0030 | 30.0 | 0.10 | 0.3~12.0 | 40/60 | 40~90 | 0.1 | -50~160 |
| JSCSF-0040 | 40.0 | 0.08 | 0.3~12.0 | 40/60 | 40~90 | 0.1 | -50~160 |
| JSCSF-0045 | 45.0 | 0.07 | 0.3~12.0 | 40/60 | 40~90 | 0.1 | -50~160 |
