Silicone-Free Thermal Pad
Silicone-Free Thermal Pad Thermal Interface MaterialThermal Interface Material
Silicone-free thermal pads contain no siloxane and eliminate the risk of silicone oil bleed, preventing issues such as lens fogging and electrical failures. They offer excellent tensile strength and abrasion resistance, making them suitable for sensors, AI data centers, security cameras, and medical equipment, with thermal conductivity up to 8.0 W/m·K.
Features :
- Thermal conductivity from 1.0–8.0 W/m·K; thickness options 0.5–5.0 mm.
- Siloxane-free, with no silicone oil bleed risk.
- Self-adhesive, supporting easy assembly and rework.
- Strong tensile strength, abrasion resistance, and excellent electrical insulation.
- Supports custom die-cutting to meet specific requirements.
- UL94 V-0 flame resistance; compliant with RoHS, Halogen-Free, and REACH.
Applications :
- Data Center
- Automotive sensors
- AI devices
- Fiber optic communication systems
- Industrial control equipment
- Hard disk drives
- Medical devices
| Model | Thermal Conductivity W/m·K | Thermal Impedance, ℃*in²/W at 30psi, 1mm | Thickness, mm | Standard Hardness, Shore 00 | Compression Rate, at 30psi, 1mm | Elongation | Operating Temp., ℃ |
|---|---|---|---|---|---|---|---|
| JSAF-0100 | 1.0 | 1.10 | 0.5~5.0 | 50/70 | 35% | 100% | -40~125 |
| JSAF-0300 | 2.0 | 0.80 | 0.5~5.0 | 50/70 | 30% | 70% | -40~125 |
| JSAF-0500 | 3.0 | 0.60 | 0.5~5.0 | 50/70 | 30% | 70% | -40~125 |
| JSAF-0600D | 4.0 | 0.40 | 0.5~5.0 | 50/70 | 30% | 50% | -40~120 |
| JSAF-0600 | 5.0 | 0.30 | 0.5~2.0 | 70 | 20% | 50% | -40~120 |
| JSAF-0600G | 6.0 | 0.25 | 0.5~2.0 | 70 | 20% | 50% | -40~120 |
