Silicone Thermal Pad

Silicone Thermal Pad Thermal Interface Material

Thermal Interface Material

Silicone thermal pads feature high softness and compressibility, effectively filling gaps between electronic components and heat sinks to improve thermal efficiency. They also provide cushioning for rough surfaces. With self-adhesive for easy assembly and rework, they offer thermal conductivity up to 15 W/m·K.

Features :

  • Thermal conductivity from 1.5–15.0 W/m·K; available in 0.3–10.0 mm thicknesses.
  • Soft and highly compressible, reducing assembly stress and protecting delicate components.
  • Self-adhesive for easy installation and rework; supports custom die-cutting.
  • Strong tensile and abrasion resistance with excellent electrical insulation.
  • UL94 V-0 flame resistance; low oil bleed and low siloxane volatility.
  • Compliant with RoHS, Halogen-Free, and REACH standards.

Applications :

  • Electric Vehicle Battery Management System
  • CPU/GPU Chips
  • Capacitors
  • Memory/VRAM particles
  • Control boards
  • Splitters
  • Relays
ModelThermal
Conductivity
W/m·K
Thermal Impedance,
℃*in²/W
at 30psi, 1mm

Thickness,

mm
Standard
Hardness,
Shore 00
Dielectric
Strength,
kV/mm
Flame
Rating,
UL94
Operating
Temp., ℃
JSSF-01001.50.900.3~10.040/60>8V-0-50~200
JSSF-03002.00.700.3~10.040/60>8V-0-50~200
JSSF-04002.50.500.3~10.040/60>8V-0-50~200
JSSF-05003.00.450.3~10.040/60>8V-0-50~200
JSSF-0500G3.50.450.3~10.040/60>8V-0-50~200
JSSF-0600D4.00.400.5~5.040/60>8V-0-50~200
JSSF-06005.00.350.5~5.040/60>8V-0-50~200
JSSF-0600G6.00.300.5~5.040/60>8V-0-50~200
JSSF-07007.00.250.5~5.040/60>6V-0-50~150
JSSF-08008.00.220.5~5.040/60>6V-0-50~150
JSSF-100010.00.180.5~5.040/60>6V-0-50~125
JSSF-120012.00.150.8~5.040/60>6V-0-50~125
JSSF-150015.00.101.0~5.040±10>6V-0-40~120
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