As electronic components continue to pack more power into ever-smaller footprints, effective heat dissipation without adding bulk has become critical. JARO Thermal is proud to unveil two all-new IC coolers—one in aluminum, one in copper—each built on a Cold-Forged Pin Fin heatsink core mated with a high-performance fan. These designs leverage the superior metallurgy of cold forging and the maximized surface area of pin fins to deliver industry-leading cooling in just 13mm overall height.
JCC00173
JCC00174
Product Highlights
1. Cold-Forged Manufacturing Advantages :
- Ultra-Fine, High-Strength Fins: High-pressure cold forging forms thousands of rigid, uniform pin fins without melting, yielding a denser metal structure than cast or extruded processes.
- Flaw-Free Metallurgy: Eliminates voids and inclusions common to melting-based methods, boosting thermal conductivity and mechanical fatigue resistance.
2. Pin Fin Structural Benefits :
- Maximized Convection Surface: Thousands of slender, evenly spaced pins create enormous surface area for air to flow through—whether side-blown or top-blown—dramatically increasing heat transfer.
- Ultra-thin design: Compared with sheet stamping or extruded fins, cold forged Pin Fin can achieve finer pitch and shorter height, suitable for applications with compact space.
3. Cold Forged vs. Extruded Comparison :
| Feature | Extruded Fins | Cold-Forged Pin Fins |
|---|---|---|
| Metal Structure | Melted and re-extruded; risk of porosity | High-pressure cold work; ultra-dense, uniform grain |
| Fin Geometry | Flat plate style | Cylindrical or polygonal pins for superior airflow |
| Thermal Efficiency | Moderate | High |
4. Copper vs. Aluminum Heat Sink Comparison :
| Feature | Cold-Forged Copper Heat Sink | Cold-Forged Aluminum Heat Sink |
|---|---|---|
| Thermal Conductivity | ≈ 400 W/m·K (Copper) | ≈ 205 W/m·K (Aluminum) |
| Weight | Heavier, providing greater structural stability | Lighter, beneficial for overall weight reduction |
| Corrosion Resistance | Excellent (requires anti-oxidation treatment) | Forms a natural oxide layer for protection |
| Cost | Relatively higher | Lower, offering better cost-performance |
| Mechanical Strength | Superior vibration and fatigue resistance | Adequate, but slightly less robust under extreme stress |
| Ideal Applications | High-density, high-power, and extreme environments | Weight-sensitive designs and mid-to-high performance cooling |
Typical Applications
- Blade Servers : Fit into narrow chassis while maintaining rack-level cooling.
- Embedded Industrial Controllers : Wide-temperature, vibration-resistant design for harsh factory floors.
- Networking & Storage Arrays : Handle tightly clustered PCBs in data-center environments.
- Mini PCs & Laptops : Upgrade thin, lightweight systems with robust thermal headroom.
- Electric-Vehicle Battery Management : Ensure stable module temperatures and long service life.
Core Summary of Cold-Forged Pin Fin IC Coolers
The cold-forged process and fine-pitch pin-fin architecture deliver an ultra-thin with a maximized heat-dissipation surface. Offered in both copper and aluminum variants, these coolers provide low thermal resistance, whisper-quiet operation, and high reliability—perfect for blade servers, industrial controllers, networking equipment, mini PCs, and electric-vehicle battery management.