JBHAE2302

Board-Level Heatsinks Heatsinks & Coolers PGA/BGA

Features

• Efficient Heat Dissipation: BGA heatsinks quickly move heat away from components using materials like aluminum or copper.
• Compact Design: BGA heatsinks match the size of ICs or components, making them efficient in limited space.
• Secure Attachment: BGA heatsinks are often glued onto ICs or components using special adhesive for efficient heat transfer.
• Versatile Use: BGA heatsinks are used in various devices such as computers, servers, gaming consoles, and industrial systems.

 Download Brochure
Request Callback